Sigrity Power DC Package Thermal Characterization模式提取封装基板热阻参数-Single-Die Package DELPHI compact Thermal Model
Sigrity Power DC Package Thermal Characterization模式是用于提取封装基板的热阻参数的,下面根据JEDEC Single-Die Package DELPHI compact Thermal Model标准介绍如何提取热阻参数,以下图为例
具体操作如下
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